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Elucidation of the mechanisms of grain growth of nanocrystalline copper under irradiation. Stacking fault tetrahedra (SFTs) attract nearby grain boundaries, causing them to merge, pinch off, and combine.
Photo Credit: Miaomiao Jin, Penghui Cao
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Our Major Affiliations: MIT-SUTD International Design Centre (IDC) Dept. of Nuclear Science & Engineering Massachusetts Institute of Technology